laser Cutting Machine manufacturer,Laser micromachining,Laser Engraving,laser marking machine, Beyond laser.

Laser Cutting FPC coverlay, Plastic Foils and Films, Ultrafast UV laser

laser cutting of the foil or film will not result in chipping of paint from the end product.

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Laser Cutting FPC coverlay, Plastic Foils and Films

The laser beam allows for controlled fusing of the foils and films and produces clear and sealed cutting edges. With the laser, you can cut even the smallest radii precisely and produce simple geometries at record speed. During laser cutting, no pressure is exerted on the foils or films by a tool, the entire process is contact-less and consequently, the end product will turn out perfect. 
Another plus: As opposed to working with a punch or a knife, laser cutting of the foil or film will not result in chipping of paint from the end product.

The benefits of a laser cutting machine: Faster than a cutting plotter, more precise than punching dies, and more economical for small series up to 1,000 pieces.


 The laser beam allows for controlled fusing of foils and films

The UV laser cutting is cold cutting, no damage on thin films or foils

The laser produces clean and sealed cut edges

The laser can cut even the smallest radii precisely

The laser can cut simple geometries at record speed

The laser is contact free, no pressure is exerted on the material

The laser consistently produces perfect results 

The laser will not result in chipping of paint from the end product



Film materials suitable for laser cutting

Material

Abbreviation

Trade names

Polyester

PES

Thermolite® Polarguard®

Polyethylene terephthalate

PET

Mylar®

Polyimide

PI

Kapton®

Polycarbonate

PC

Lexan® Makrolon®

 The Film materials which is suitable for laser cutting can be below products:

Medical components, Flexible circuit board, FPC cover films, Electronics parts, Auto parts, Aviation&Aerospace components, watch components, IC module, Cell phone components, Photovoltaics, Battery foil, Aluminum foil, Solar panel, Wafer microelectronics, Semiconductor microelectronic material, Precision material, Polymer Film, Silicon Wafer, Polycarbonate, polyester or polyimide membrane keyboards.

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Beyond laser focus on high precision smart laser equipment development and manufacturing, for micro processing precision products, tiny components, extremely thin films or foils, including laser cutting, laser dicing, laser scribing,  laser drilling, laser marking. Using Picosecond laser, nanosecond laser, Femtosecond laser, which is ultra-fast laser, ultrashort-pulsed laser, high precision processing. No damage, no heat, no carbonization for material. 

Our equipments include more than 20 models, with first-class quality level, high stable performance, high cost-effective, already sold to more 50 countries, covering North America(USA, Canada), Europe, Japan, Australia, South-east Asia.  


Our laser equipment widely used in electronics, IC chips, electrical appliances, lighting fixtures, jewelry, bathroom accessory, instruments and meters, automobile and motorcycle accessories that defend bath, mobile communications parts, molds, precision machinery, medical equipment, IT digital metal shell, military aviation parts, garment leather, craft gifts, advertising, decoration, model, cookers, tableware, kitchen utensils and appliances and other industries. Beyond laser can provide a variety of automatic online laser marking, laser cutting equipment. 

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Headquarters

Beyond Laser Corp

Shuitian 1st Road No.13,Tongle Community,Longgang District,Shenzhen,China 

Zip code: 518116

Tel:+86 755 89765109

Fax:86-75589765677

sales@chaoyuelaser.com

Mob:+86 18926522726





  



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